SMT service introduction:
Eliboard provides SMT processing services, our professional team builds complete PCB and PCBA quality control system. During the components soldering process, high-quality solder paste is used to ensure the reliability and stability of the welding. Our production line is equipped with automatic printing machine, high-speed placement machines, AOI automatic optical detectors, etc., which can effectively ensure the reliability and quality in the electronic packaging process. Regarding the SMT testing, we have professional engineers to implement preliminary planning, prevention, and monitoring. After the completion of the transaction, we review the quality management of improvement, standardization, and other aspects. We use various test fixtures to perform 100% batch testing. Before delivery the products to customers, we will do automatic Optical Inspection (AOI), X-Ray inspection, and burn-in testing, aim to provide high quality, zero defect products.
Solder Paste Printing>Mounting>AOI>Reflow Soldering>AOI Check>DIP>Wave Soldering>Funtion Test>PCBA
Solder Paste Printing
The process of depositing solder paste on PCB to establish electrical connectionselectrical connections.
Using the PCB placement machine to put the required components on the PCB of the printed solder paste.
The solder paste is fused between the components and the PCB by reflow.
Check the fusion between PCB and the circuit and test the function of the circuit.
The PCBA plug-in of the DIP elements.
Melting the angle of the DIP element above the PCB.
perform functional test of the circuit.
How does EliBoard Work?
|Printing stencils size：470*380-900*900mm|
|Printing PCB size：50*50-610*600mm|
|Printing PCB thickness：0.4-5mm|
|Minimum package ：01005Chip/0.4mmBGA|
|Reflow Type：Up/Down 10 Temperature Area|
|Reflow PCB Temperature Differential：±1.5℃|
|Max Reflow PCB Size：400mm|
|Wave Soldering Type：Hot Blast/Infrared|
|Wave Soldering PCB Size：50-350mm|
|Wave Soldering Speed：500-1800mm/min|
|X-RAY Inspector：Minimum focusing size 0.25um|
|Size of carrier table：500*510mm|
|Bad types of detection: missing, tin, tin, tin, bias, bad shape, pollution on the surface.|
|SPI Inspector： Deviation, bad shape, surface pollution|
|Maximum PCB panel size：M-size-X330*Y250mm|
|AOI Inspector：PCB size：630*520mm|
|PCB component Height：0.5~5.1mm|
|PCB warpage: less than 3mm bending is acceptable|
|Intelligent first piece detector: average component test time: 3 seconds|
|Test rigour: system entry and analysis of data|
|Test traceability: querying database and saving record|
|BGA rework：PCB-size：Max-430*450mm Min-15*22mm|
|chip size：Max-80*80mm Min-2*2mm|